IC COB Package Bond Testing Machine MD-PT3018
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Описание
IC COB package bond testing machine md-pt3018 Introduction: This pull bonder tester is designed for testing the pull strength of the wire bonded on the chip and the push strength of the gold ball on the chip and the die bonding strength(COB). Specification:Dimension:350mm*400mm*500mmPower in:220VPower:5WMicroscope:15/30X OR 20/40X Push strength range:0-5000G(accuracy: 0.001KG)Meter brand:SPPull strength range:0-30G(accuracy:1G)Meter brand:DESKJig:depend on product(standard jig: COB, DIP,SMD,High power LED)Precision lead screw:stroke:200MM Micrometer:0-25MM(2 pcs)Precision slide:4PCSWeight:30kg Operation:1,put the product to the jig; 2,adjust the meters to zero;3, under the microscope, turn the hand wheel slowly, so to push the product to close to the meters; 4, align the probe or hook on the meter to the gold ball or wire. 5, turn the micrometer slowly, the meter can get a value of the strength. be careful of the strength range of the meter!Related other wire bonders:----------------------------------------------------------------------------------------------------------------------------------------------------------------guangzhou minder-hightech co.,ltdcontact:shunyu.hu cellphone:0086-15813334038
Свойства товара
- Model NO: md-pt3018
- Power Sourc: AC 85V-265V
- Weigh: 〉10Kg
- Installatio: Portable Precise
- Customize: Non-Customized
- Transport Packag: Plywood
- Specificatio: 30kg
- Trademar: minder-hightech
- Origi: Guangzhou
- HS Cod: 8015809090
- Production Capacit: 50000/Year